PG Level Advanced Certification Programme in
Sensor Technologies and Chip Design
- IISc
Home > PG Level Advanced Certification Programme in Sensor Technologies and Chip Design – IISc
Programme Overview
Programme Highlights
IISc-Certified Expertise: Get Certified by Centre for Continuing Education (CCE) at IISc
Master Sensor Technology: Design, MEMS, FEM simulations expertise
Collaborative Learning: Build networks through peer interaction
Industry-Relevant Curriculum: Case studies aligned with market needs
World-Class Facilities: Practical learning in advanced cleanrooms
Flexible Learning: Live online classes for professionals
Advanced Technical Mastery: Specialize in Chip Design, CMOS, Logic Families, and microengineered device integration
Hands-On Experience: World-class experience in cleanroom environments (1,000/10,000), laboratory access, and micro-fabrication
Eligibility Criteria
- Education Qualification: Should have completed B.Tech./B.E/M.Sc./M.E./M.Tech. in Electronics, Electrical, Mechanical, Instrumentation, Physics, Materials Engineering/Science, Chemical Engineering or similar.
- Work Experience: 6 months (preferred, but not mandatory).
Selection Process
- Candidates will be shortlisted based on the Programme Directors’ discretion.
Who can attend?
- Working professionals and recent graduates keen to build a career in Sensor Technologies, Digital Design, FPGA Programming, Chip Design, Electronic Product Design, and Artificial Intelligence for sensors.
Syllabus Breakdown
Explore the evolving space of sensor technologies and chip design from application, design and fabrication to its real-world applications:
- Overview of Sensors and Transducers​
- Sensors and Transducer Characteristics: accuracy, precision, sensitivity, specificity, resolution, and selection criteria​
- Overview of MEMS​, Integration of mechanical elements, sensors, actuators, and electronics​​
- Importance and role of sensors and transducers in engineering fields (e.g., Industry and Biomedical applications)​
- Overview of various sensor types: Temperature sensor, Motion sensor, Hall effect sensor, pMUTs and cMUTs, UV sensor, IR sensor, Pressure sensor​
- Sensor Interfacing: Customized PCB Design ​
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- Thermal Oxidation​
- Diffusion and Ion Implantation​
- Deposition Techniques: Physical Vapour Deposition Techniques (PVD) (E-Beam evaporation, Thermal evaporation, and Sputtering), Chemical Vapour Deposition (CVD).​
- Lithography and Patterning Techniques for Sensor Fabrication​
- Introduction to Bulk Micromachining & Surface Micromachining​
- Etching Techniques: Wet etching and Dry etching​
- Characterization Techniques – STM, AFM, Spectroscopy, XRD​
Overview of electronic system design consideration for sensors​
Amplifiers Types (Differential, Instrumentation, and Nonlinear Amplifiers) and Topologies used in Sensing systems and their Practical Applications​
Unilateral negative Feedback, Linear and Frequency-independent Amplifiers used in Sensing systems​
Active Filters and Noise removal in Sensor Amplifiers​
Static and dynamic error in Sensor Amplifiers and their Compensation in Sensor Amplifiers​
- Introduction to the world of finite element method (FEM) using COMSOL Multiphysics​
- Learn how to build geometry and meshing, apply physics, set up studies and analyze results​
- Learn how to do step-by-step Multiphysics analysis from a simple problem to a fully coupled Multiphysics model​
- Hands-on demo on various sensors and actuators – Piezoresistive, Piezoelectric, Electromechanical, Pressure-based, Inertia-based, Thermal actuators​
- Parameter optimization and performance analysis through simulations​
- System integration of sensors – key concepts and challenges​
- "Statistical analysis for sensor characterization – deep dive" and hypothesis testing with an example​
- Model based System Engineering (MBSE) – how to do structured system design around a packaged sensor?​
- Hands on with SysML and papyrus​
- Introduction to Piezoelectricity and ultrasound waves​
- Ultrasound imaging modes​
- Medical and Industry Applications ​
- Image formation and quality metrics​
- Beamforming and image reconstruction​
- Field measurements and cavitation​
- Introduction to VLSI and ASIC Design: Moore’s law, scaling technique​
- Introduction to CMOS technology​
- Design rules and layout techniques for CMOS implementation​
- Introduction to Verilog/VHDL for hardware description​
- Low-power design techniques: voltage scaling, clock gating, and power gating​
- Energy-efficient circuit design strategies for battery-powered applications​
- Advanced Memory Design like SRAM, DRAM, FLASH, etc.​
- Timing Analysis and Signal Integrity​
- Design for Testability (DFT) and Verification​
- Basics IC Design flow: From RTL to GDS Overview​
- Programmable devices - Field Programmable Gate Array (FPGA)​
- Verilog constructs: Programming concepts (for, if-else, etc.), Vectored signals, Generic statements​
- Verilog Examples based on Digital Logic, including Decoders, Encoders, Moore, and Mealy Finite state machines, Counters, FIFO, etc.​
- Construction of MOSFET​
- Operation of MOSFET: I-V characteristics, Non-ideal IV Effects​
- CMOS Inverter: Static CMOS DC Characteristics, Beta Ratio effects, Noise margin, Delay, and Power computation​
- CMOS Circuits: Static CMOS circuits and other logic families such as Domino logic, Pseudo NMOS, Pass Gate logic​
- Comparison of Static CMOS and other circuits​
- Design and analysis of logic gates and other And-OR-Invert and Or-And-Invert logic Circuits; Design of 4x16 Decoder as an Example.​
- Delay analysis: Elmore delay models and Logical Effort — Finding the best number of stages, finding the best design with leads to minimum delay.​
- Static Timing Analysis of Digital Circuits including Setup, Hold time violations​
- Memory design: 6T and 8T SRAM memory cell, design, analysis, noise margins, and peripherals.​
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- Introduction to cleanroom protocols and equipment​
- Hands-on training on various cleanroom equipment: Thermal and E-beam Evaporation tool, Sputtering tool, Mask aligner, Wire bonder, and Wet benches​
- Hands-on training on soft lithography technique and 3D printing​
- Sessions on sensor interfacing and analog circuit design ​
Mentor-assisted Hands-on sessions
Capstone ProjectsÂ
 Live Lectures by faculty Â
Industry Sessions
Campus Visits
India's #1 University (2016-24) & Research Institute (2021-24)
India's #1 University (2024)
2 Bharat Ratna Awardees
About IISc
India's #1 University (2016-24) & Research Institute (2021-24)
India's #1 University (2024)
2 Bharat Ratna Awardees
About CCE
The CCE is committed to evolving effective teaching norms and methods, providing educational services, conducting workshops, designing specialized courses, organizing tests and examinations, and issuing appropriate grading certificates to participants, all in accordance with the Institute’s established standards.
Know The Facilitators
Associate Professor​​
Department of Electronic Systems Engineering​
Division of Electrical, Electronics, and Computer Science​
Associate Faculty
Department of Design and Manufacturing​
Division of Mechanical Sciences​
IISc, Bangalore​
Department of Electronic Systems Engineering​​
Division of Electrical, Electronics, and Computer Science​
IISc, Bangalore​
Department of Electronic Systems Engineering
IISc, Bangalore​
Electrical Engineering Principal
Investigator, MUSE Laboratory
IIT Gandhinagar
Department of Sciences and Humanities​
(Biomedical Engineering)​
IIITDM Kancheepuram
Electrical Engineering
IIT Gandhinagar
Programme Certification
- To receive a Completion Certificate, attendees must have more than 70% attendance and score above 50%. A Participation Certificate is awarded to those with more than 50% attendance and a score above 35%. No certificate is given if attendance is below 50% or marks are below 35%.
NOTE: *The sample certificate is indicative. The Institute reserves the right to revise it.
Programme Structure
As mentioned in the offer letter
3rd month from programme commencement
Note:-
- Campus visit fee will be based on actuals and to be borne by the participants.
- Fees paid are non-refundable and non-transferable.
-  The total fee mentioned above includes lab charges as well.  Â
- *18% GST extra as applicable.
The Jaro Advantage
- Unparalleled career guidance and support
- Dedicated student support
- Immersive and lifelong learning experiences
- Learn from the best-suited academic, faculty, and industry mentors
- Be a part of discussions and forums for enhanced learning
- Leverage peer-to-peer learning experience
- Alumni Network of 3,50,000+ Professionals
- Access to alumni events & other benefits
- Stay up to date with the latest insights from your alma mater
Build 21st-Century Skill set to Gain Career Edge in the VUCA World
You’ll learn
- Hands-on Experience: Work with cutting-edge microfabrication tools and micro-technology systems.
- Cleanroom Training: Gain practical exposure in-class 1000/10,000 cleanroom environment, essential for precision-driven sensors
- Practical Exposure: Work with custom-fabricated and commercial sensors, honing your skills to solve real-world challenges.
- In-Depth Skill Development: Learn to design and fabricate MEMS sensors, optimize performance using FEM techniques, and integrate sensors with electronic systems.
- Chip Design Proficiency: Build mastery in VLSI design, digital system programming, and advanced memory system design.
- AI and Image Processing: Explore sensor integration with AI-driven systems and image-based technologies to power emerging innovations.
- Capstone Project: Develop expertise in sensor technologies through simulation, electronic module design, and real-world applications.
The programme aims to equip professionals with advanced skills in sensor technologies, MEMS fabrication, digital chip design, and AI-driven solutions, preparing them to lead innovations in industries like healthcare, automotive, and consumer electronics.
This certification is tailored for engineers, researchers, and industry professionals keen on advancing their expertise in sensor technologies, VLSI design, and AI integration, especially those working in or aspiring to join semiconductor and IoT-driven industries.
Participants will gain proficiency in MEMS sensor fabrication, FEM simulations with COMSOL, additive manufacturing, AI integration with sensors, VLSI design, and advanced digital circuit design, including memory systems and CMOS logic families.
Yes, the programme includes extensive hands-on training in cleanroom facilities, practical labs, and projects using industry-standard tools for MEMS, VLSI, and digital chip design.
The programme is delivered through live online classes, interactive sessions, and a campus visit for hands-on lab experience, ensuring flexibility for working professionals.
Graduates can pursue roles in semiconductor design, IoT development, healthcare tech, automotive systems, and consumer electronics, with the potential to lead R&D or innovation-focused teams.